Advanced Packaging & Interconnects
Improve accuracy and throughput in dicing, packaging, and testing using high-performance optics, lasers, and composite materials.
- Enhance Stability Mitigate mechanical and thermal issues in systems by using advanced composites.
- Precision Processing Create smaller, more precise features and cuts for advanced packaging with high-performance lasers.
- Versatile Marking Mark semiconductors, polymers, ceramics, metals, and more with high-performance lasers.
Higher Throughput
From wafer dicing to final packaging and test, back-end processes for increasingly smaller chips demand higher speed, greater mechanical precision, and reduced cost. Coherent products help achieve these goals throughout the production line. Metal matrix composites deliver mechanical parts with improved flatness, stiffness, and thermal conductivity, plus lower weight. Lasers delicately perform a variety of drilling and cutting processes that cannot be accomplished mechanically, as well as numerous non-contact marking tasks.
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