Lasers
Rapid LX
The optimal laser source for brittle material cutting, as well as a flexible UV solution for micromachining, in a physically compact and economic design.
Rapid LX has a unique combination of pulse energy and operational flexibility for significantly reduced cost-per-part over previous generation USP lasers. It's ideally suited for brittle material cutting, micromachining in flat panel display and microelectronics processing.
Rapid LX Nominal Specifications
Choose up to 250 µJ single pulse energy at 1064 nm, or 50 µJ at 355 nm, and work at repetition rates from single-shot to 5 MHz with excellent beam quality.
Product Specifications
Model |
Wavelength (nm) |
Average Power (W) |
Repetition Rate (MHz) |
Pulsewidth (ps) |
Pulse Energy (μJ) |
RAPID LX IR |
1064 |
30 |
Single shot to 5 MHz |
<10 |
250 |
RAPID LX UV |
355 |
10 |
50 |
Featured Blog
PulseEQ: Process The Most Delicate Materials Without Thermal Damage
Lasers are used to produce many of the highly miniaturized and complex devices around us–from mobile devices to medical implants. But in some highly demanding tasks, even the most advanced lasers need a little help. Read how PulseEQ improves laser cutting in these precision applications by eliminating thermal effects.
