Semiconductor Equipment

Build manufacturing and testing equipment with the speed and accuracy needed for advanced chips and next-generation packaging.

Build equipment that maximizes throughput and yield using cutting-edge optics, lasers, and composite materials.

Improve accuracy and throughput in dicing, packaging, and testing using high-performance optics, lasers, and composite materials.

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Materials for Better Semiconductor Packaging

Advanced materials improve thermal management to enable packaging of thinner microelectronic components.

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