6” InP capability bringing unprecedented scale to Photonics
Coherent introduces world’s first 6-inch InP scalable wafer fabs for high-speed semiconductors and beyond.
December 09, 2024 by Coherent
Suddenly, the future looks much bigger for InP (indium phosphide) wafers. It’s no secret that InP wafers provide a powerful solution for high-speed photonic devices in telecommunications and beyond. But the latest milestone?
Coherent recently announced the world’s first 6-inch capability for InP wafer fabrication in the company’s Sherman, Texas, and Järfälla, Sweden wafer fabs.
With this breakthrough comes new technological advancements and advantages, chief among them 4X more production capacity and a 60% reduction in die costs for devices widely used in a broad range of applications.
Overall, the transition to 6-inch indium phosphide wafers represents a significant advancement in the semiconductor industry. Next, we will dive into some key reasons for this transition.
LARGER InP WAFERS SHIFT THE PARADIGM
Cost-effective. Reliable. High-speed. Sustainable. In addition to these high-level advantages, larger indium phosphide (InP) wafers, like our newest 6-inch offering, provide several significant benefits that are important for the advancement of semiconductor technology, and beyond:
Increased Production Capacity. Larger wafers allow for more devices per wafer enabling the overall production capacity of the fabs to be scaled up to meet the rapidly increasing demand for photonic devices in growing markets like AI interconnect, datacom, telecom, automotive, industrial, and consumer, enhancing competitiveness and profitability.
Reduced Die Cost. Shifting to 6-inch wafers allows Coherent to leverage higher-capacity, more-efficient automated process tools enabling both increased capacity for the fab without expanding the footprint and lower labor costs per wafer. These improvements result in a greater than 60% reduction in die cost.
Improved Efficiency. The larger wafer size delivers improved uniformity which results in better yield. It also reduces the amount of overhead cost per die from activities like wafer certification.
Future Applications. 6-inch InP wafer fabrication allows for production capacity for these in-demand examples, including:
- Coherent optical communications: Used in a number of high-speed data transmission applications
- Datacom transceivers: Essential for data centers and communication networks
- AI interconnects: Supporting emerging innovation and increased demands in artificial intelligence applications
- Advanced sensing: Used in consumer electronics, wearables, medical devices, automotive applications, and more
- 6G wireless and satellite communications networks: InP wafers will play a significant role in wireless technologies later this decade
A More Sustainable Option. As production grows in efficiency, the impact on resources only improves, as well as its sustainability. In the semiconductor industry, advances in manufacturing (such as larger InP wafers) can help support the overall reduction of energy intensity, according to a 2023 Deloitte study.
OUR ROLE IN THE FUTURE OF TRANSCEIVERS
High-performance workhorses—coherent transceivers—are like marathon runners. They sprint across thousands of kilometers, carrying data at rates up to 800 gigabits per second on a single wavelength. Demand only grows stronger for these applications, but so does our integration of expertise, technology, and manufacturing capability.
Coherent InP photonic integrated circuits support laser wavelengths required for dense multiplexed systems that encode and decode complex modulation waveforms. Ultimately, this capability allows these wavelengths to carry high-capacity data across long haul networks and more.
In datacom and AI applications, InP-based externally modulated lasers and high-power CW source lasers are enabling the rapid deployment of transceiver solutions for very large datacenters and machine learning clusters. The rapid scaling of the demand for these applications requires a fab capability that can scale with it--and the move to 6” wafer sizes will enable this.
World-class quality, performance, time-to-market, and cost advantages are key pillars across a broad portfolio of product offerings at Coherent, including several existing products migrating on the new 6-inch InP platform, such as 200G electro-absorption modulated lasers (EML), 200G distributed-feedback lasers with integrated Mach-Zehnder modulators (DFB-MZ), 100G EML, and high-speed photodetectors and CW lasers for silicon photonics applications.
IN LOCKSTEP WITH FUTURE INNOVATION AND NEEDS
As demand for lasers, detectors, and electronics continues to increase across industries and applications, Coherent is in the process of evolving production from 3-inch InP to 6-inch InP to take full advantage of the benefits of larger wafer sizes across the board.
This important transition is essential for the demands of an evolving market and can help your organization sustain a competitive advantage. As a leader in transceivers for decades, rest assured Coherent will keep pace with innovation and shifting market demands to partner in meeting your emerging needs.
Learn more about Coherent indium phosphide (InP) wafer fabrication.
