Semiconductor Equipment

Build manufacturing and testing equipment with the speed and accuracy needed for 7 nm chips and next-generation packaging.

Build equipment that maximizes throughput and yield using cutting-edge optics, lasers, and composite materials.

Improve accuracy and throughput in dicing, packaging, and testing using high-performance optics, lasers, and composite materials.

Featured Blog

Materials for Better Semiconductor Packaging

Advanced materials improve thermal management to enable packaging of thinner microelectronic components.

Share your contact info and a specialist will reach out.

Opt In YES! I want Coherent news and promotions emailed to me.

Required field

Online shopping for lasers, optical fibers, power meters and sensors, accessories, and much more on Coherent online has never been easier.

Shop Now