Networking
High-Power 100 mW DFB Laser Diode Chips
Get 100 mW of uncooled output power and 300 mW of output power when cooled, to enable 100 Gbps and 200 Gbps per lane, respectively, for cutting-edge O-band transceivers.
These chips are available in four wavelength bands to match coarse division multiplexing (CWDM) wavelength requirements in uncooled DR4 and DR8 transceivers. They feature high reliability and are qualified according to GR-468 for use in non-hermetic packages.
High-Power 100mW Laser Diode Chips
Get these chips tested and Inspected on translucent tape with grip-ring Ø 150 mm. Future-proof technology that can support advanced silicon transceiver designs to 1.6T.
Key Features
Designed for uncooled O-band CWDM4
Qualified according to GR-468 for use in non-hermetic packages
Excellent reliability
Top anode and backside cathode configuration
RoHS compliant
Available wavelengths - CWDM4 1270 nm to 1330 nm
Related Products
Featured Success Story
Laser Framework Makes a Mark in Siemens’ Digital Factory
Coherent applications development support and Coherent Laser FrameWork software enable Siemens to successfully implement their ID Link manufacturing program.
