Materials
Ceramics Capabilities
Get unique mechanical, chemical, electrical, and thermal properties of our advanced ceramics and composites to create innovative products.
Coherent has extensive capabilities for developing high-performance reaction-bonded ceramics and metal matrix composites - optimized to meet the needs of specific applications - and can reliably fabricate production parts in whatever volume required.
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Applications Overview
Semiconductor Equipment Semiconductor tool makers achieve a competitive advantage using composite parts with high flatness, reduced weight, and high thermal conductivity. |
LCD Manufacturing Equipment High-precision structural components for production tooling offer superior strength/stiffness ratios, and can be made in large, complex shapes to tight tolerances. |
Thermal Management Leading-edge thermal management devices that dissipate and manage heat sources in high-end electronics and related applications. |
Nuclear Power Novel composites cost less than sintered boron carbide and enable neutron absorption systems with fewer seams for easier installation and refurbishment. |
Optics Lightweight, strong mirrors and support structures are used in various optical platforms in defense, aerospace, communications, and precision industrial applications. |
Wear and Refractory Composite components for wear, mining, and refractory uses offer size and shape flexibility, superior strength, minimum weight, and exceptional wear characteristics. |
Armor Ceramics Ceramics meet the needs for personnel protection, vehicle armor, and lightweight/high-strength structures for helicopters. |
Related Products
Featured Blog
SiC Circuitry Makes EVs Better
Coherent is one of the few companies worldwide with a complete, vertically integrated SiC manufacturing capability. We produce SiC wafers and epitaxy, all the way through power devices and modules. Furthermore, the unmatched quality with which we can produce SiC material makes Coherent virtually the only supplier positioned to successfully transition from the current standard wafer diameter of 150 mm up to 200 mm.
Featured Success Story
Laser Framework Makes a Mark in Siemens’ Digital Factory
Coherent applications development support and Coherent Laser FrameWork software enable Siemens to successfully implement their ID Link manufacturing program.
