Activation of Dopants with UV Excimer Lasers
Laser used	VarioLas Family
Other Competible Lasers	LPXpro Series Excimer Lasers
Material	Semiconductor
Process	Surface Modification

UV excimer lasers are enabling tools in the formation of ultra shallow junctions (USJ) for ever smaller CMOS logic devices such as CPUs and memory chips, of power devices such as insulated gate bipolar transistors (IGBTs) and of advanced CCD or CMOS based image sensors. The respective functional structures are activated by diffusion-controlled UV excimer annealing with ... more

Alumina Drilling and Scribing with CO2 Lasers
Laser used	DIAMOND K-Series
Material	Ceramic
Process	Cutting and Scribing Drilling Ablation-Material Removal

Aluminum oxide or alumina (Al203) is the standard substrate material for high-performance electronic circuits. The circuit fabrication process commonly requires that this substrate be scribed, drilled, or cut. The CO2 laser is particularly well matched to the characteristics of alumina, and offers a number of important benefits for performing these functions over traditional mechanical ... more

Aluminum Nitride (AlN) Processing with CO2 Lasers
Laser used	DIAMOND K-Series
Material	Ceramic
Process	Cutting and Scribing Ablation-Material Removal

Aluminum nitride (AlN) is beginning to replace alumina as a substrate and heat sink for electronic circuits. This is because AlN offers a much higher thermal conductivity (about eight times that of alumina), and is not toxic (as is another alternative, beryllium oxide). Unfortunately, the high thermal conductivity of AlN makes it difficult to laser machine, because ... more

Analysis of Solid Samples with the 193nm Excimer Laser
Laser used	GeoLasPro
Other Competible Lasers	Excimer Lasers
Material	Ceramic Composite Glass Metal Plastic Semiconductor
Process	Ablation-Material Removal

Excimer laser ablation in combination with inductively coupled plasma-mass spectrometry (LA-ICP-MS) is a powerful technique for reliable solid sample analysis. The sample is excimer laser ablated at 193nm in an air-tight chamber and the originating aerosol plume is carried by an inert gas to a micro-wave induced plasma where its constituents are atomized and ionized prior to ... more

Annealing of Silicon Backplanes with 540W Excimer Lasers
Laser used	LAMBDA SX-Series
Other Competible Lasers	LineBeam Excimer Lasers
Material	Semiconductor
Process	Surface Modification

Excimer Laser Annealing (ELA) is a key process for making Low Temperature Poly-Silicon (LTPS) used in flat panel displays. Here the rectangular beam from a 308 nm excimer laser is homogenized and formed to produce a beam with a line-shaped cross section. This line beam profile is directed at the silicon coated substrate which is then scanned ... more