Edge Isolation
c-Si Edge Isolation
Laser process tools enable ultra-narrow c-Si line scribing while minimizing sub-surface damages such as microcracking.

 
Superior Reliability & Performance

  • Lasers and Laser-based Systems
  • Laser Measurement and Control
  • Precision Optics
  • Related Accessories

Laser process tools for Edge Isolation all feature AVIA lasers; currently the dominant laser source for c-Si UV-laser Edge Isolation, with over 90% market share. Within laser Edge Isolation, a high-speed scanner directs UV or green nanosecond laser pulses around the perimeter of cells, scribing narrow grooves between the finger grid and the cell edges. The use of short-wavelength laser output enables ultra-narrow scribe lines (<30 μm), reduced ‘dead’ area around the trenches, and minimized sub-surface laser damage. Sub-surface damage – a negative outcome of using long wavelength IR lasers – can include changes to minority carrier lifetimes and bulk microcracking.

 
AVIA Family of DPSS Lasers
High power lasers offered at 532 nm, 355 nm and 266 nm, with output power as high as 45W.
AVIA
 
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